技术支持-成都光创联科技有限公司

넳 넲

成都光创联自创立以来就专注光电集成技术，致力于从多通道集成器件的开发演进到板级以及基片级的高密度混合集成光互联技术的开发。

自2019年7月建成投产多通道集成产品线起，光创联陆续率先推出800G COBO光引擎（2019）、支持工温的25G MWDM TOSA（2020）、集成式Combo PON ONU (2021)、光传输100G ZR+光组件（2022）、FMCW Lidar硅光外腔激光器（2023）、400G 相干C+L band ITLA（2024）以及可见光RGB多芯片集成MCL光源模块（2024）等业内领先产品。

经过多年的技术、产品以及市场积累，公司已通过细分市场领先策略成为业内认可的、领先的高速光电集成器件供应商，服务全球一流客户。

TO - based Platform /同轴产品平台

● Narrow linewidth laser

● Innovative integration design beyond traditional TO - based Optics

● Proprietary “Eugen - Passive Process” to ensure reliable mass production

● Pioneering in compact, integrated, and multi - port OSAs of challenging specs

● Featured products:

■ Quad - OSA for XG/XGS Combo PON ONU/OLT

■ 10G/25G EML TDM/CWDM/DWDM TOSA

■ 25G TOSA / ROSA / BOSA (10km, 30km,80km)

■ 50G/100GLR1/ER1 TOSA/ROSA/BOSA

Box Platform /盒型产品平台

● Single channel and Planar multi - channel integration

● Cooled TEC in transmitter, built - in TIA in receiver

● Hermetical sealing to ensure high reliability

● Non - hermetical solutions also available to support cost reduction

● Featured products:

      ■ Single channel 10G/25G D/L/CWDM DML/EML TOSA

      ■ Single lambda 50G/100G TOSA

      ■ 100G LR4/ER4/ZR TOSA/ROSA/BOSA

      ■ Non - hermetical 100G ROSA

      ■ 400G LR4/ER4 TOSA/ROSA

      ■ Tunable laser/ITLA

Chip on Board Platform/COB平台

● Hybrid optoelectronics integration: Chip on Board (COB), Optics on Board, Co - packaging on board or submount level

● High performance in signal and power integrity

● low cost by eliminating surplus intermediary package

● Featured products:

■ 400G DR4 optical engine

■ 800G 2x FR4 optical engine

CPO光电共同封装

CPO光电共同封装（Co-package Optics）技术就是在板级或基片级采用裸芯片（如激光器芯片，硅光芯片等）间混合集成封装，有效应对800G以上速率在密度尺寸、功耗、电磁辐射干扰性能及成本等方面的严峻挑战。在可预见的3-5年内，光电共同封装CPO技术将逐渐改变光电互联的技术方案以及业内生态，给光电器件行业带来革命性影响。